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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/20 tsz02201-0g1g0an00410-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 20.may.2015 rev.004 www.rohm.com datashee t ldo regulators with voltage detector 500 ma output ldo regulator with voltage detector BD4275FP2-C bd4275fpj-c general description BD4275FP2-C and bd4275fpj-c are automotive suited voltage regulator with 1ch reset and offers the output current of 500ma while limitin g the low quiescent current. these regulators are therefore ideal for applications requiring a direct connection to the battery and a low current consumption. a reset signal is generated for an output voltage vo of typ 4.62 v. the reset delay time can be programmed by the external capacitor. features ? aec-q100 qualified. (1) ? low esr ceramic capacito rs applicable for output. ? low drop voltage: pdmos output transistor ? power on and under-voltage reset ? programmable reset delay time by external capacitor. (1): grade 1 applications ? onboard vehicle device (body-control, car stereos, satellite navigation system, etc) key specifications ? qualified for automotive applications ? input voltage range: -0.3 v to +45 v ? low quiescent current: 65 a (typ) ? output load current: 500 ma ? output voltage: 5.0 v 2 % ? reset detect voltage : 4.50 v to 4.75 v ? over current protection (ocp) ? thermal shut down (tsd) package w (typ) d (typ) h (max) ? fp2: to263-5f 10.16 mm 15.10 mm 4.70 mm ? fpj: to252-j5f 6.60 mm 10.10 mm 2.38 mm figure 1. package outlook typical application circuit ? vcc and vo pin capacitors: 0.1 f c in (typ), 6 f c o (min) please refer to the "selection of co mponents external ly connected". figure 2. typical application circuit ro v cc gnd ct vcc vo v o r o c in c o downloaded from: http:///
2/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 pin configurations figure 3. pin configurations pin descriptions block diagram figure 4. block diagram pin no. pin name function 1 vcc supply voltage input 2 ro reset output; open-collector output. 3 gnd ground; pin3 internally connected to fin. 4 ct reset delay; connect capaci tor to gnd for setting delay time. 5 vo 5 v output; fin fin fin; fin internally connected to pin3. 12 34 5 to252-j5f (top view) fin 1 2 3 4 5 to263-5f (top view) fin downloaded from: http:///
3/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 block descriptions block name function description of blocks reference reference voltage the reference generates the reference voltage. error amplifier error amplifier the error amplifier amplifies the difference between the feed back voltage of the output voltage and the reference voltage. tsd thermal shutdown protection the tsd protects the dev ice from overheating. if the chip temperature (tj) reaches ca. 175 c (typ), the output is turned off. ocp over current protection the ocp protects the device fr om damage caused by over current. uvlo under voltage lock out the uvlo prevents malfunction of the reset block in case of very low output voltage. downloaded from: http:///
4/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 absolute maximum ratings parameter symbol limits unit vcc voltage (1) v cc -0.3 to +45.0 v ro voltage v ro -0.3 to +18.0 v vo voltage v o -0.3 to +7.0 v power dissipation (to263-5f) (2) pd 1.9 w (to252-j5f) (3) pd 1.3 w junction temperature range tj -40 to +150 c storage temperature range tstg -55 to +150 c (1) not to exceed pd. (2) reduced by 15.2 mw / c over ta = 25 c, when mounted on glass epoxy board: 114.3 mm 76.2 mm 1.6 mm. (3) reduced by 10.4 mw / c over ta = 25 c, when mounted on glass epoxy board: 114.3 mm 76.2 mm 1.6 mm. recommended operating ratings parameter symbol min max unit supply voltage (i o 300ma) (1) v cc 5.5 45.0 v supply voltage (i o 500ma) (1) v cc 5.9 45.0 v start -up voltage v cc 3.0 v output current i o 0 500 ma operating ratings temperature ta -40 125 c (1) not to exceed pd. thermal resistance parameter symbol min max unit to263-5f package junction to ambient (1) ja 15.6 c / w junction to case (bottom) (1) jc 1 c / w to252-j5f package junction to ambient (2) ja 19.2 c / w junction to case (bottom) (2) jc 1 c / w (1) to263-5f mounted on 114.3 mm 76.2 mm 1.6 mmt 4-layer glass-epoxy pcb. (top copper foil: rohm recommended footprint + wiring to measure / copper foil on 2 inner layers and the reverse side of pcb:74.2 mm 74.2 mm) (2) to252-j5f mounted on 114.3 mm 76.2 mm 1.6 mmt 4-layer glass-epoxy pcb. (top copper foil: rohm recommended footprint + wiring to measure / copper foil on 2 inner layers and the reverse side of pcb:74.2 mm 74.2 mm) downloaded from: http:///
5/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 electrical characteristics ( unless otherwise specified , tj = -40 c to +150 c, v cc = 13.5 v ) parameter symbol limits unit conditions min typ max circuit current i cc 65 150 a i o = 0 ma output voltage 1 v o 4.90 5.00 5.10 v 5 ma i o 400 ma 6 v v cc 28 v output voltage 2 v o 4.90 5.00 5.10 v 5 ma i o 200 ma 6 v v cc 40 v dropout voltage t vd 0.25 0.5 v v cc = 4.75 v, i o = 300 ma load regulation reg.l 10 30 mv i o = 10 ma to 250 ma line regulation reg.i -15 15 mv v cc = 8 v to 16 v, i o = 5 ma current limit i ocp 500 ma ripple rejection r.r. 60 db f = 120 hz, ein = 1 vrms, i o = 100 ma thermal shut down temperature t tsd 175 c electrical characteristics ( reset function ) ( unless otherwise specified , tj = -40 c to +150 c, v cc = 13.5 v ) parameter symbol limits unit conditions min typ max switching threshold v rt 4.50 4.62 4.75 v switching hysteresis v rhy 20 60 100 mv upper delay switching threshold v cth 1.18 v lower delay switching threshold v ctl 0.25 v charge current i ct 8.8 a v ct = 0.5 v delay time l h t por 10 14 18 ms c ct = 0.1 f (1) ro l voltage v rol 0.4 v ro pull-up resister 4.7 k ? v o 1v (1) t por can be varied by changing the ct capacitance value. ( 0.001f to 10 f available ) t por (ms) t por0 ( the reset delay time at c ct = 0.1 f ) c ct ( f) / 0.1 ct capacitor : 0.1f c ct 10 f example: when c ct = 1f, 100ms t por 180 ms t por (ms) t por0 ( the reset delay time at c ct = 0.1 f ) c ct ( f) / 0.1 0.1 ct capacitor : 0.001f c ct < 0.1 f example: when c ct = 0.01f, 0.9ms t por 1.9 ms downloaded from: http:///
6/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 0 1 2 3 4 5 6 024681 0 output voltage : v o [v] supply voltage : v cc [v] j = j = j = 4.6 4.7 4.8 4.9 5.0 5.1 5.2 -40 0 40 80 120 output voltage : v o [v] junction temperature : tj [ ] typical performance curves ( unless otherwise specified , tj = 25 c, v cc = 13.5 v ) figure 5. output voltage vs supply voltage ( r l = 25 ? ) figure 6. output voltage vs supply voltage (at low supply voltage, r l = 25 ? ) figure 7. output voltage vs temperature (r l = 1 k ? ) figure 8. circuit current vs supply voltage 0 1 2 3 4 5 6 0 1 02 03 04 0 output voltage : v o [v] supply voltage : v cc [v] 0 200 400 600 800 1000 0 1 02 03 04 0 circuit current :i cc [ a] supply voltage : v cc [v] downloaded from: http:///
7/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 0 20 40 60 80 100 0 100 200 300 400 500 circuit current :i cc [ a] output current : i o [m a] 0 30 60 90 120 150 -40 0 40 80 120 circuit current :i cc [ a] junction temperature : tj [ ] 0 1 2 3 4 5 6 0 200 400 600 800 1000 output voltage: v o [v] output current : i o [m a] 0 200 400 600 800 1000 -40 0 40 80 120 output current : i o [m a] junction temperature : tj [ ] typical performance curves ( unless otherwise specified , tj = 25 c, v cc = 13.5 v ) -continued figure 9. circuit current vs output current figure 10. circuit current vs temperature figure 11. output voltage vs output current (over current protection) figure 12. output current vs temperature downloaded from: http:///
8/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 4.3 4.4 4.5 4.6 4.7 4.8 -40 0 40 80 120 output detecting voltage : v rt [v] junction temperature : tj [ ] 0 1 2 3 4 5 6 1 0 01 2 51 5 01 7 52 0 0 output voltage:v o [v] junction temperature : tj [ ] 0 100 200 300 400 500 600 0 1 0 02 0 03 0 04 0 05 0 0 drop voltage : vd [m v] output current : i o [m a] j = j = j = typical performance curves ( unless otherwise specified , tj = 25 c, v cc = 13.5 v ) -continued 0 1 2 3 4 5 6 0123456 ro voltage : v ro [v] vo voltage : v o [v] j = j = j = figure 13. drop voltage vs output current (v cc = 4.75 v) figure 14. output voltage vs temperature (thermal shut down) figure 15. ro voltage vs vo voltage ( ro: 10 k ? p ull-u p to vo ) figure 16. output detecting voltage vs temperature (ro: 10 k ? pull-up to vo) downloaded from: http:///
9/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 10 12 14 16 18 -40 0 40 80 120 power on res et tim e : t por [m s ] junction temperature : tj [ ] typical performance curves ( unless otherwise specified , tj = 25 c, v cc = 13.5 v ) -continued figure 17. power on reset time vs temperature (c ct = 0.1 f) figure 18. power on reset time vs ct capacitance 0.01 0.1 1 10 100 1000 10000 0.001 0.01 0.1 1 10 power on reset tim e : t por [m s] ct capacitance : c ct [ f] downloaded from: http:///
10/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 vcc ct gnd ro vo vcc ct gnd ro vo vcc ct gnd ro vo vcc ct gnd ro vo vcc ct gnd ro vo vcc ct gnd ro vo measurement circuit for typical performance curves figure 19. measurement circuit for typical performance curves timing chart figure 20. timing chart a v v a a v a a monitor r l 4.7 f 0.1 f 10 f 4.7 f 0.1 f 10 f 4.7 f 0.1 f 10f 4.7 f 0.1 f 10 f 4.7 f 0.1 f 10k ? c ct measurement circuit for figure.5, 6, 7, 8, 10, 14 measurement circuit for figure.11, 12 measurement circuit for figure.9 measurement circuit for figure.13 measurement circuit for figure.15, 16 measurement circuit for figure.17, 18 10k ? v (1) v rec = v rt + v rhy (2) v ru = 2v to 3.5 v o o rec r r cl c v cc v o v ct v ro downloaded from: http:///
11/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 power dissipation to263-5f ic mounted on rohm standard board based on jedec. board material: fr4 board size: 114.3 mm 76.2 mm 1.6 mmt top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm 0 mm) : 2-layer pcb (copper foil area on the reverse side of pcb: 15.0mm 15.0 mm) : 2-layer pcb (copper foil area on the reverse side of pcb: 74.2mm 74.2 mm) : 4-layer pcb (2inner layers and copper foil area on the reverse side of pcb: 74.2mm 74.2 mm) to252-j5f ic mounted on rohm standard board based on jedec. board material: fr4 board size: 114.3 mm 76.2 mm 1.6 mmt top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm 0 mm) : 2-layer pcb (copper foil area on the reverse side of pcb: 15.0mm 15.0 mm) : 2-layer pcb (copper foil area on the reverse side of pcb: 74.2mm 74.2 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm 74.2 mm) figure 21. package data of to263-5f figure 22. package data of to252-j5f 1.8 w 1.3 w 4.1 w 6.5 w 0 2 4 6 8 10 0 2 55 07 51 0 01 2 51 5 0 power dissipation: pd [w] ambient temperature: ta [c] 0 2 4 6 8 10 0 2 55 07 51 0 01 2 51 5 0 power dissipation: pd [w] ambient temperture: ta[ ? c] 8.0w 5.0w 2.3w 1.9w downloaded from: http:///
12/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 thermal design refer to the heat mitigation characterist ics illustrated in figure 21, 22 and the power dissipation under actual operating conditions should be taken into consider ation and a sufficient margin should be allowed for in the thermal design. the amount of heat generated depends on t he voltage difference across the input and output, load current, and bias current. therefore, when actually using the ch ip, ensure that the generated heat does not exceed the pd rating. even if the ambient temperature ta is at 25 c, it is possible that the junction temperature tj reaches high temperatures. keep the whole operating temperature range within tj tjmax. should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 114.3mm 76.2mm 1.6mmt glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. the following method is used to calculate the power consumption pc (w) pc = ( v cc - v o ) i o v cc i cc power dissipation pd pc the load current i o is obtained by operating the ic within the power dissipation range. (refer to figure 10 for the i cc .) thus, the maximum load current i o max for the applied voltage v cc can be calculated during t he thermal design process. the following method is also used to calculate the junction temperature tj. to263-5f ? calculation example : with to263-5f package , ta = 105 c, v cc = 13.5 v, v o = 5.0 v, board (figure 21.) at ta = 105 c with figure 21 condition, the calculation shows that 211 ma of output current is possible at 8.5 v potential difference across input and output. ? calculation example : with tc (bottom) = 80 c, v cc = 13.5 v, v o = 5.0 v, i o = 200 ma, board (figure 21.) pc of the ic can be calculated as follows: pc = ( v cc - v o ) i o + v cc i cc pc = ( 13.5 v - 5.0 v ) 200 ma + 13.5 v i cc pc = 1.7 w ( i cc = 80 a ) in case the power consumption pc is 1.7 w, the j unction temperature tj can be calculated as follows: tj = pc jc + tc tj = 1.7 w jc + 80 c tj = 81.7 c ( jc (bottom) = 1 c / w refer to page 4 thermal design) the junction temperature is 81.7 c, at above condition. v cc : input voltage ta : a mbient temperature v o : output voltage tc : case temperature i o : load current tj : junction temperature i cc : circuit current jc : thermal resistance (junction to case (bottom)) pc : power consumption i o pd - v cc i cc v cc - v o i o 1.8 w C 13.5 v 80 a 13.5 v C 5.0 v ( i cc = 80 a ) tj = pc jc + tc 211 ma i o pd at over 25 c is calculated by below. pd = (pd at 25 c) (150 - ta) / (150 - 25) in case of board in figure 21, ta = 105 c pd = 1.8 w downloaded from: http:///
13/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 selection of components externally connected ? vcc pin capacitor insert capacitors with a capacitance of 0.1 f or higher between the vcc and gnd pin. we recommend using ceramic capacitor generally featuring good high frequency char acteristic. when selecting a ceramic capacitor, please be consider about temperature and dc - biasing characterist ics. place capacitors closest possible to vcc - gnd pin. when input impedance is high, e.g. in ca se there is distance from battery, line voltage drop needs to be prevented by large capacitor. choose the capacitance according to t he line impedance between the power smoothing circuit and the vcc pin. selection of the capacitance also depends on the applications. verify the application and allow sufficient margins in the design. we recommend using a capacitor with excellent voltage and temperature characteristics. ? output pin capacitor in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd pin. we recommend using a ceramic capacitor with a capacitance of 6 f or higher. in selecting the capaci tor, ensure that the capacitance of 6 f or higher is maintained at the intended applied voltage and temperature range. due to changes in temperature the capacitor's capacitance can fl uctuate possibly result ing in oscillation. in actual applications the stable op erating range is influenced by the pcb impedance, input supply impedance and load impedance. therefore verifica tion of the final operating environment is needed. when selecting a ceramic capacitor, we recommend using x7r or better components with excellent temperature and dc - biasing characteristics and high voltage tolerance. in case of the transient input voltage and the load current fluctuation, output voltage ma y fluctuate. in case this fluctuation can be problematic for the applicati on, connect low esr capacitor (capacitance > 6 f, esr < 1 ? ) in paralleled to large capacitor with a capacitance of 13 f or higher and esr of 5 ? or lower. electrolytic and tantalum capacitors can be used as large capacitor . when selecting an electrolytic capacitor, please consider about increasing esr and decreasing capacitance at cold temperature. place the capacitor closest possible to output pin. i/o equivalence circuits 1 vcc 2 ro 4 ct 5 vo figure 23. i / o equivalence circuits 100 ? (typ) 20 k ? (typ) 6 ? (typ) 500 k ? (typ) 1500 k ? (typ) vcc c downloaded from: http:///
14/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 application examples ? applying positive surge to the vcc if the possibility exists that surges higher than 45 v will be applied to the vcc, a zener dio de should be placed between the vcc and gnd as shown in the figure below. figure 24. application example 1 ? applying negative surge to the vcc if the possibility exists that negative sur ges lower than the gnd are applied to the vcc, a shottky diode should be place between the vcc and gnd as shown in the figure below. figure 25. application example 2 ? implementing a protection diode if the possibility exists that a large inductive load is connecte d to the output pin resulting in back-emf at time of startup a nd shutdown, a protection diode should be placed as shown in the figure below. figure 26. application example 3 ? reverse polarity diode in some applications, the vcc and the vo potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. for example, t he accumulated charge in the output pin capacitor flowing backward from the vo to the vcc when the vcc shorts to the gnd. in order to minimize the damage in such case, use a capacitor with a capacitance less than 1000 f. also by inserting a reverse polarity diode in series to the vcc, it can prevent reverse current from reverse battery connection or the case. when the point a is short-circuited gnd, if there may be any possible case point b is short-circuited to gnd, we also recommend using a bypass diode between the vcc and the vo. figure 27. application example 4 a vcc vo gnd bypass diode reverse polarity diode downloaded from: http:///
15/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration the power dissipation under actual op erating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. on the re verse side of the package, the ic has an exposed heat pad for improving the heat dissipation. use both the front and reverse side of the pcb to increase the heat dissipation pattern as far as possible. the amount of heat generated depends on the voltage diffe rence across the input and output, load current, and bias current. therefore, when actually using the chip, ensure that the generated heat does not exceed the pd rating. should by any condition the maximum junction temperatur e tjmax = 150 c rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. the thermal impedance in this specification is based on recommended pcb and measurement condition by jede c standard. verify the application and allow sufficient margins in the thermal design. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capa citor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic duri ng assembly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
16/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 operational notes C continued 10. unused input pins input pins of an ic are oft en connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the outsi de can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction th rough the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. 11. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automat ically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 14. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transit ioning of the protection circuit. downloaded from: http:///
17/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 physical dimension tape and reel information package name to263-5f downloaded from: http:///
18/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 physical dimension tape and reel information C continued package name to252-j5f downloaded from: http:///
19/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 ordering information b d 4 2 7 5 x x x - c e 2 part number package fp2: to263-5f fpj: to252-j5f packaging and forming specification e2: embossed tape and reel marking diagram to263-5f (top view) bd4275fp2 part number marking lot number 1pin to252-j5f (top view) bd4275j part number marking lot number 1pin downloaded from: http:///
20/20 20.may.2015 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 BD4275FP2-C bd4275fpj-c datasheet tsz02201-0g1g0an00410-1-2 revision history date revision changes 5.apr.2013 001 new release 25.sep.2013 002 p5 the condition of ro l voltage at electrical characteristics was changed. p10 the timing chart was corrected. p11 the statement of reference data of package data of to263-5f and to252-j5f was deleted. p13 the information of output pin capacitor was changed. p15 the information of operational notes was changed. p17 to263-5f quantity written in tape and reel information was corrected. p18 to252-j5f physical dimension was corrected. 29.nov.2013 003 p11 the package data of to263-5f was corrected. p16 the information of operational notes was changed. 20.may.2015 004 p1 key specifications (reset detect voltage) was corrected. p1 aec-q100 grade was added. p1 the information of vcc and vo pin capaci tors at typical application circuit was added. p4 revised expression on annotation of thermal resistance. p11 revised expression on the pcb information of power dissipation. p13 revised expression on the information of vcc pin and output pin capacitors. p14 added description on reverse polarity diode. p15 revised expression on the information of thermal consideration. p17 to263-5f direction of feed written in tape and reel information was corrected. downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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